ICM-20603

The ICM-20603 is a 6-axis MotionTracking device for Augmented Reality / Virtual Reality applications that combines a 3-axis gyroscope, 3-axis accelerometer, in a small 3x3x0.75mm (16-pin LGA) package.  In addition, the ICM-20603 comes with a compatible 1KHz 9-axis low latency and accurate heading sensor fusion library to create a platform for compelling new sensor-rich VR devices.

  • High performance specs
    • Gyroscope sensitivity error: ±1%
    • Gyroscope noise: ±4mdps/√Hz
    • Accelerometer noise: 100µg/√Hz
  • Includes 1K-byte FIFO to reduce traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode
  • EIS FSYNC support

ICM-20603 includes on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts. The device features an operating voltage range down to 1.71V. Communication ports include I2C and high speed SPI at 10MHz.

Part # Gyro Full Scale Range Gyro Sensitivity Gyro Rate Noise Accel Full Scale Range Accel Sensitivity Digital Output Logic Supply Voltage Operating Voltage Supply Package Size
UNITS: (°/sec) (LSB/°/sec) dps/√Hz (g) LSB/g (V) (V +/-5%) (mm)
ICM-20603
ICM-20603
±250
±500
±1000
±2000
131
65.5
32.8
16.4
±4mdps/√Hz ±2
±4
±8
±16
16384
8192
4096
2048
I²C or SPI VDD 1.71 - 3.45 3x3x0.75

Features

  • 1KHz 9-aixs Sensor Fusion Library for Cortex M4/M3 Platforms
  • 3-Axis Gyroscope with Programmable FSR of ±250dps, ±500dps, ±1000dps and ±2000dps
  • 3-Axis Accelerometer with Programmable FSR of ±2g, ±4g, ±8g and ±16g
  • User-programmable interrupts
  • Wake-on-motion interrupt for low power operation of applications processor
  • 1K byte FIFO buffer enables the applications processor to read the data in bursts
  • On-Chip 16-bit ADCs and Programmable Filters
  • Host interface: 10MHz SPI or 400kHz Fast Mode I2C
  • Digital-output temperature sensor
  • VDD operating range of 1.71 to 3.45V
  • MEMS structure hermetically sealed and bonded at wafer level
  • RoHS and Green compliant
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