Abdi, a member of InvenSense’s board of directors since June 2011, was appointed President and CEO in October 2012, and now serves as General Manager of MEMS Sensors Business Group. Most recently, he served as Executive Vice President and General Manager of NetLogic Microsystems, Inc., a leader in intelligent semiconductor solutions for the Internet. Before this, he served as the President and Chief Executive Officer of RMI Corporation (also known as Raza Microelectronics Inc.), a fabless semiconductor company, from November 2007 to October 2009. He served as Senior Vice President and General Manager of CDMA Technologies (QCT) at Qualcomm, Inc., a provider of wireless technology and services, from March 2004 to November 2007. Prior to joining Qualcomm, he held leadership and engineering positions at Motorola, Inc. where he served as Vice President and General Manager for Motorola’s radio products division, in charge of RF and mixed-signal ICs for the wireless mobile market. He currently is a director at Tabula, Inc. and Exar Corporation.
Abdi holds a BSEE from Montana State University and an MSEE from the Georgia Institute of Technology.
Deputy General Manager & Chief Operations Officer
Amir Panush joined InvenSense in April 2015 to head the company’s Strategy & Corporate Development where he drove strategic expansion and diversification, ultimately leading to successful acquisition by TDK. Since the merger completion in 2017 and until 2019 he served as our VP & General Manager of the Motion and Pressure Business Unit, and now serves as Deputy GM & Chief Operations Officer (COO) of the MEMS Business Group. Prior to joining InvenSense, Amir served as Senior Director Product Management and Business development of IoE/IoT Client business at Qualcomm Inc. (NASDAQ: QCOM). Prior to that, he was Director of Automotive Product Management of Qualcomm Atheros division where he grew the business from inception to widespread adoption by tier 1 automotive customers. Prior to Qualcomm, Amir led strategic marketing and partnerships at Atheros Communications (acquired by Qualcomm). His earlier industry roles spanned software engineering and project management leadership at Texas Instruments and Comsys Mobile (acquired by Intel).
Amir holds a Master of Business Administration from Haas Business School, University of California at Berkeley and a bachelor’s degree, Cum Laude, in Computer Science from Technion Institute of Technology in Israel.
GM & VP – Worldwide Sales
Scott Deutsch joined TDK-InvenSense in December 2018 and serves as GM and Vice President of Worldwide Sales for the Sensors Sales Group. Prior to joining InvenSense, Scott was the COO at Elliptic Labs, a late stage startup which developed the first of its kind software virtual sensor platform. From 2013 to 2016, Scott served as Senior Vice President of Worldwide Sales at Synaptics, a global leader in human interface technologies. Prior to Synaptics, Scott was the Vice President of Worldwide Sales for AuthenTec. Scott also held positions of Vice President of Worldwide Sales at Alereon and Vice President of Sales and Marketing for SanDisk’s OEM Consumer Products Division. Earlier in his career, Scott was General Manager Americas and VP Worldwide Sales for M-Systems and Director of Sales for the Western U.S. with MMC Networks. Before joining MMC Networks, Scott spent eight years at Cypress Semiconductor in various sales and management roles.
Scott received a Bachelor of Science Degree in electrical engineering from Fresno State University and an MBA for Global Innovators from California State University, East Bay.
GM & VP – Finger Print Business Unit
Divi Gupta joined TDK in April 2016 to lead the company’s Strategic Marketing and R&D in the US and now serves as VP & General Manager of the Fingerprint Business Unit. In the Strategic Marketing and R&D role, Divi led organic and inorganic technology strategy, completing two acquisitions, and built an R&D center. Prior to joining TDK, Divi served as CEO at Newlans, a venture funded startup building tunable RF components, which was bought by TDK in January 2016. Prior to founding Newlans, he was a Sales Engineer and then a Senior Financial Analyst at Narad Networks, a provider of high-speed data connectivity over cable networks, where he ran customer trials and built models of customer deployments respectively.
Divi holds a MBA from The Wharton School, University of Pennsylvania, an MS in Electrical Engineering, and a BS in Electrical Engineering from The University of Massachusetts Amherst.
Chief Technology Officer
Dr. Peter G. Hartwell is Chief Technology Officer at InvenSense. Peter has over 25 years’ experience commercializing silicon MEMS products, working on advanced sensors and actuators, and specializes in MEMS testing techniques. At InvenSense Peter is responsible for technology strategy and leads our Advanced Technology research group. Prior to joining InvenSense, Peter spent four years as Architect of Sensing Hardware at Apple where he built and led a team responsible for the integration of accelerometer, gyroscope, magnetometer, pressure, proximity, and ambient light sensors across the entire product line. Before Apple, Peter was a Distinguished Technologist at Hewlett-Packard Laboratories where he spent 12 years. At HP, he was the MEMS lead on HP’s 10 nano-g/rt Hz MEMS accelerometer forming the basis of HP’s Central Nervous System for the Earth (CeNSE), an early version of what has become the Internet of Things (IoT). Peter has over 40 worldwide patents on MEMS devices and sensor applications.
Peter holds a B.S. in Materials Science from the University of Michigan and a Ph. D. in Electrical Engineering from Cornell University.
GM & VP – Microphone Business Unit
Hiro Hayashi is the General Manager and Vice President of the Microphone Business Unit since April 2017, as part of the TDK team, he was located in Dongguan, China, within the assembly and test facility until his recent transfer to silicon valley headquarters in San Jose, California. Prior to that role, Hayashi-san headed the Radio Frequency Module Business Unit at TDK from 2014 to 2017 leading Operations, Product Development and Program Management. Earlier, he held senior leadership positions in Program Management and Test Engineering for RF module business, WiFi and Bluetooth, and established the foundation for TDK’s RF module technologies, leading its key accounts. Hayashi-san joined TDK Corporation in 1993 as an R&D researcher, facilitating TDK Electronics Ireland, where he assisted in the establishment of the TDK European Design Center as Engineering Manager from 1999 to 2005.
Hayashi-san received a Bachelor of Electronics Engineering degree in Electrical and Electronics Engineering from Yamanashi University in Japan.
Vice President – Systems & Software
Al Heshmati joined InvenSense in Dec 2012 and serves as Vice President of Systems & Software.
Al has extensive commercial experience in development of location technology, motion sensing solutions, wireless, and SOC design. Prior to InvenSense, he was Vice President of Software at CSR (previously SIRF), and before that he held several engineering leadership roles at Qualcomm, SnapTrack, and Trimble Navigation.
Al received his B.S. and M.S. degrees in Computer Science from Cal State University, Fullerton. He has 20 US patents issued or pending.
Vice President – Operations
Eric Kawamoto joined InvenSense in Mar 2015 and serves as Vice President of Operations. Prior to joining InvenSense, Eric held senior leadership positions in Connectivity Product Marketing and Wireless Audio Product & Test Engineering at Microchip, was Vice President and General Manager of the Consumer Electronics Solutions business unit at SMSC and was the CDMA/WCDMA and RF Point Solutions Operations Manager at Motorola SPS, Radio Products Division.
Eric received his BSEE and MSEE degrees in Solid State Device Physics from the University of Hawaii at Manoa, Physical Electronics Laboratory.
Michelle Meng-Hsiung Kiang
GM & VP – Ultrasonic Business Unit
Michelle Kiang is the General Manager and Vice President of the Ultrasonic Business Unit at TDK and co-founder of Chirp Microsystems, Inc., a company commercializing an ultra-low power, ultrasonic 3D sensing technology that will revolutionize human machine interfaces for IoT devices. Chirp was acquired in February 2018 by TDK as a wholly own subsidiary, and Michelle became Vice President and General Manager of the new business unit under TDK’s MEMS Sensor Business Group. Most recently, she led corporate business development at NeoPhotonics, managing M&A, strategic investment, and partnership activities. Previously, she was the Director of Strategy and Planning for the Image Sensor Group at Micron Technology. Her prior startup experience included as the co-founder and VP Marketing for PINC Solutions, a leading provider of sensor-fusion enabled real-time visibility solutions, and Onix Microsystems, a pioneer in MEMS-based optical networking products.
Dr. Kiang received the M.S. and Ph.D. degrees from University of California, Berkeley, and the B.S. degree from National Taiwan University, all in Electrical Engineering. She is the recipient of the David Sakrason Award for her outstanding thesis work at UC Berkeley.
GM & VP – Motion and Pressure Business Unit
Stephen Lloyd is the General Manager and Vice President of the Motion and Pressure Business at TDK; prior to this role, Stephan held the position of Vice President of Engineering and New Product Development since joining InvenSense in December 2008. Prior to joining us, he worked at several semiconductor companies, including service from 2004 to 2008 at Beceem Communications, first as Vice President of Engineering for RF Microelectronics and later as Executive Vice President of Engineering. From 2002 to 2004, he served as Executive Director of RF IC Design for Skyworks Solutions, and from 1997 to 2002, he served as an Executive Director of Conexant Systems.
Mr. Lloyd received his B.S. in Electrical Engineering from the University of California, Berkeley.