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Sign up to manufacture your MEMS today on InvenSense's proven silicon process. Sixth InvenSense Shuttle slated for takeoff on September 15, 2014.
The InvenSense Shuttle gives MEMS developers the opportunity to fabricate their designs on InvenSense’s patented InvenSense Fabrication MEMS-CMOS integrated platform. This proven process has been used to produce over 200 million inertial sensors that have been integrated into a variety of applications. The InvenSense Shuttle is a multi-project shuttle service that is open to qualified MEMS device developers from commercial companies as well as from the research community. Contact email@example.com to reserve your seat on the next InvenSense Shuttle.
InvenSense Shuttle designs are built on the InvenSense Platform which combines the best properties of standard CMOS fabrication and single-crystal SOI-based MEMS. Each wafer is fabricated separately using the appropriate optimized process. Then the MEMS and CMOS wafers are bonded together using a patented, low-temperature eutectic bond process. The direct MEMS and CMOS wafer integration approach hermetically seals the MEMS devices at the wafer level and enables direct MEMS to CMOS interconnect, and wafer-level testings. Resulting devices can be packaged in any standard semiconductor package, including the smallest and lowest cost Quad Flat No lead (QFN) package. Based on 0.18um CMOS geometry on 200mm wafers, the InvenSense Platform provides MEMS device developers with a mass-production, ready platform for development and commercialization.
Traditionally MEMS device designers spend more than 50% of their effort designing the fabrication process, inhibiting their ability to ramp to mass production quickly or achieve low cost chip yields. InvenSense created its InvenSense Shuttle program to remove the fabrication barrier and allow MEMS device designers to create their own innovative designs on its established fabrication platform, providing a direct path to low-cost, reliable, high-volume manufacturing.
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