Dual Axis MEMS Gyroscopes

Overview

InvenSense’s Dual Axis family of MEMS gyro sensors sense rotation on two axis of movement; x (pitch) and z (yaw) on a single chip with in-plane mounting. The innovatively designed gyroscope features two separate outputs per axis for higher speed motions and lower-speed precise movements, and is best suited for motion-based gaming and television 3D remote control menu navigation.

Applications

Part # Full Scale Range (FSR) Sensitivity Output Operating Voltage Supply Package Size Documentation Evaluation Board (EVB) Device
UNITS: (°/sec) (mV/°/sec) (V) (mm) (.pdf) (add to cart) (add to cart)

IXZ-2510
±250
±500
±1000
±2000
131
65.5
32.8
16.4
I²C
SPI
1.71 to 3.45 3x3x0.9 Datasheet App Note

IDG-2020
±31.25
±62.5
±125
±250
262
131
65.5
32.8
I²C
SPI
1.71 to 3.6 3x3x0.9 Product Spec Register Map
Evaluation Board Guide App Note

  • Disclaimer


    • InvenSense sensors should not be used or sold in the development, storing, production and utilization of any conventional or mass-destructive weapons or any other weapons or life-threatening applications as well as in any other life-critical applications including but not limited to medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. In devices or systems whereby malfunction of these products can be expected to result in personal injury and casualties, InvenSense customers using or selling these products do so at their own risk and agree to keep InvenSense harmless from any consequences. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranty, either expressed or implied with respect to any product, and specifically disclaims all other warranties, including warranties for merchantability, non-infringement, and fitness for any particular purpose. For more information go to Terms and Conditions.

The Future of Sensor System on Chip