The IDG-400 gyroscope utilizes state-of-the-art MEMS fabrication with wafer-scale integration technology. This technology combines completed MEMS wafer and completed CMOS electronic wafers together using a patented and proprietary wafer-scale bonding process that simultaneously provides electrical connections and hermetically sealed enclosures. This unique and novel fabrication technique is the key enabling technology that allows for the design and manufacture of high performance, multi-axis, integrated MEMS gyroscope in a very small and economical package. Integration at the wafer-level minimizes parasitic capacitanes, allowing for improved signal-to-noise over a discrete solution. It also enables the incorporation of a rich feature set which minimizes the need for external amplification.
| Part # | Full Scale Range (FSR) | Secondary Output (FSR) | Sensitivity | Sensitivity Secondary Output | Output | Operating Voltage Supply | Package Size | PDF Documentation | Evaluation Board (EVB) | Purchase | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| UNITS: | (°/sec) | (°/sec) | (mV/°/sec) | (mV/°/sec) | (V) | (mm) | (.pdf) | (add to) | (add to) | |||
 IDG-400 |
±500 | N/A | 2 | N/A | Analog | 3.0 ±10% | 4x5x1.2 |
|
||||
